Contributed by M. Alarcon, R. Fontaine, P. Gamache, D. James, R. Krishnamurthy, J. Morrison, D. Yang and C. Young —————————————————————————————————————————- Click here for FREE DOWNLOAD of the full Samsung Galaxy S5 Basic Product Teardown ...
Contributed by St.J. Dixon-Warren Vertical Insulated Gate Bipolar Transistors (IGBTs) are one of the most important types of discrete power transistors. Structurally, they are similar to discrete, vertical N-type MOSFET devices, except the N-type drain region of the MOSFET is replaced by a P-type collector or anode region. The result is a PNP bipolar structure, [...]
If you’ve read part 1 and part 2 of this series, you’re now looking for more info on the #AppSung trial deliberation. By Richard Moses Following nearly a month long trial, the four-man, four-woman jury deliberated for three days before reaching their decision. Along with deciding infringement and validity, the jury was also tasked to [...]
If you read Part 1 of this article, you’re now looking for the flipside of the Apple vs. Samsung analysis – claims by Samsung. The key point of this two part blog is that the ability to extract and understand claim limitations is critical. This will play a key role in the trial and subsequent [...]
Contributed by Dick James As we did last year, we went along to the Mobile World Congress (MWC), held in Barcelona last week. The intent was to take the pulse of the mobile business, not just the big announcements like the Samsung Galaxy S5, but also the parts that go into mobile devices. Dominant Themes [...]
Contributed by: Sinjin Dixon-Warren IBM’s Semiconductor Division and Intel have been two of the primary drivers of advanced CMOS development for nearly fifty years. Although Intel has usually been first to market with a new technology node, IBM has continued to be a major source of innovation in advanced CMOS technology over the past decades. [...]
Contributed by Dick James When Intel launched their Haswell series chips last June, they stated that the high-end systems would have embedded DRAM, as a separate chip in the package; and they gave a paper at the VLSI Technology Symposium  that month, and another at IEDM . It took us a while to track [...]