Contributed by Dr. Sinjin Dixon-Warren

TSMC’s 28 nm CMOS technology platform is currently their most advanced offering. Our analysis suggests that this will be a very profitable technology platform for TSMC and for their fabless design partners for many years to come. In fact, Chairman Morris Chang expects that 28 nm will be the biggest...

December 11, 2012 | Read Article...

Systems analysis identifies how devices are used together – and may include testing of signals and software inside or between chips using sniffers, probing, data capture, or literature. Systems analysis, including software reverse engineering, is performed to identify evidence of use in support of patent licensing and litigation. It can also be...

December 5, 2012 | Read Article...

Contributed by Ray Fontaine

Canon’s APS-C and FF CIS supply chain is much simpler than Nikon’s. While Sony CIS components have been found in Canon digital compact cameras, Table 1 shows the Canon CIS design wins for five Canon FF DSLRs analyzed by Chipworks.  The Canon APS-C devices analyzed (not listed) have all been found to be...

October 24, 2012 | Read Article...

Contributed by Ray Fontaine

This is a three part blog series on full-frame (FF) format cameras. Part I reviews Nikon and Sony’s relationship, Part II will discuss Canon’s FF product strategy, and Part III will address new entrants to the sector and speculation on the future of FF format cameras.

Part I: Nikon vs. Sony and Nikon <3 (...
October 23, 2012 | Read Article...

In our last teardown blog we promised that it would be the last one on an Apple product for at least a short while (we have a nice DSLR camera and a frightening Halloween teardown queued-up).

Lesson learned. Don't make promises.

Reverse engineering is not forward engineering done backwards and so you never know what you will learn...

October 18, 2012 | Read Article...
We couldn’t help but notice that there is a lot of speculation and discussion (and frankly, a few wild guesses) concerning the functions of the Apple’s new lightning connectors. We don’t normally give (a total of five blogs!) this much attention to a single electronics teardown, but since we haven’t seen it elsewhere yet, we figured the world...
October 15, 2012 | Read Article...

The chips that deliver the RF capabilities of a phone tend to be over shadowed by more consumer-friendly specifications like the number of GB of storage, or the clock speed of a processor. However, they are critical to the user experience of the device. Because of the nature of radio frequencies, they also require a complex number of different...

October 2, 2012 | Read Article...

Knowing what we know of some of our web traffic and the comments in the twittersphere and elsewhere, we know that one of the most closely guarded and also the most sought after pieces of information is the maker of the camera modules. For the flagship phones like the iPhone 5, we take a close look at both the primary...

September 21, 2012 | Read Article...

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