Launch day for the iPad 3 began very early as our team has been camped out at Best Buy in Ottawa since 3:30 am. We were first in line and our 4G unit made it back to the labs in no time at all. Yesterday we were lucky enough to be able to examine the high resolution images provided to us by our friends at iFixit via Melbourne, Australia. That opportunity allowed us to determine what was new and what was not. Our findings from that were that we have a whole lot of devices being recycled from the iPhone 4, iPhone 4S, and iPad 2.
| 5 Mp Back Illuminated CMOS Image Sensor
The 5 Mp CMOS image sensor is new to the 3rd gen iPad, but is it new to us? It is very likely that Apple has recycled the 5 Mp back illuminated CMOS image sensor from the iPhone 4. That unit was the Omnivision OV5650. The OV5650 is the second generation back illumination (BSI) technology from OmniVision. (clarification added March 19, 2012 – this is second generation BSI-1 with noted improvements over the first BSI-1 sensor we analyzed. It does not have the full feature-set consistent with BSI-2 and OmniVision does not market it as such) This 5 Mp camera features 1.75 µm pixels, and is designed to deliver DSC quality in a mobile phone application. The sensor supports 720p HD video at 60 fps and 1080p at 30 fps. Apple specifications for the new iPad also tout the same specification. So the analysis we have just completed . . . drum roll please . . . says that the 5 Mp back illuminated CMOS image sensor in the new iPad is the same, it is the Omnivision OV5650 (die markings OV290BF). Yet again, Apple is recycling as many devices as they can to produce this new iPad. This is a very smart technique that keeps their costs and technological risks low. Apple would have placed large orders for this camera to build the iPhone 4 and now again for the new iPad, so hopefully they are leveraging these volumes to get a low unit price per camera. Chipworks conducted a full analysis of the OV5650 when it first appeared in the iPhone 4. We have an Imager Process Review as well as die photos on this device in the Chipworks Store. |
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| Secondary Image Sensor
The secondary CMOS image sensor inside the new iPad is also a design win for Omnivision. This camera, the OV297AA, is a 0.3 Mp, 3.0 µm pixel pitch CMOS image sensor. Chipworks has seen this on the iPod Nano and the iPad 2. |
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| A5X
The A5X in the new iPad was a bit of a surprise to us in that in previous iProducts using the A5 and A4 processors, that processor was configured in a package-on-package (PoP) assembly, whereby the LP DDR2 SDRAM sat on top of the A processor. In the new iPad, the A5X sits on one side of the motherboard and the twin Samsung LP DDR2 SDRAm (qty 2) sat on the other side of the motherboard. Of note is the recurring theme of Apple dual sourcing DRAM. The unit iFixit purchased in Australia utilized Elpida LP DDR2 and our unit utlized Samsung LP DDR2. The A5X part number is APL5498 and the die markings repeat that same number as well. The balance of die markings indicate Samsung being the foundry for this processor (we really did not expect to see TSMC making the A5X, but one never knows). The A5x die measures 12.82 mm x 12.71 mm for an area of 162.94 mm². Compared to the A5 which measures 10.01 mm x 11.92 mm for an area of 119.32 mm². That is an increase in the die area by 36.5%! A fairly large increase to accommodate the dual-core CPUs and quad-core graphics processor. This indicates that Apple stuck with Samsungs’ low power 45 nm CMOS process. Our cross section is in progress now, so we’ll know soon enough when we can measure the contacted gate pitch. |
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Update:
We have confirmed that the A5X is indeed manufactured on Samsungs 45 nm LP CMOS Process. The measurements have been made and it’s in the bag. We show you here a general structure of the A5X.
Here is a more complete BoM table:
| Component Manufacturer | Item# | Device Type | |||
| Apple | 338S0987 (Cirrus Logic) | Audio Codec | |||
| 343S0561-A1 (Dialog Semi) | PMIC | ||||
| APL5498 (A5X) | Dual Core CPU & Quad Core GPU | ||||
| MD366C/A_Sec-Camera | Omnivision OV5650 | ||||
| MD366C/A-Pri-Camera | Omnivision OV297AA | ||||
| Asahi Kasei | AK8975 | Electronic Compass | |||
| AVAGO | ACPM-5904 | Power Amplifiers | |||
| ACPM-5917 | Power Amplifiers | ||||
| ACPM-7792 | Power Amplifiers | ||||
| Broadcom | BCM4330XKUBG | WiFi SoC | |||
| BCM5973A1KUFBG | Microcontrollers | ||||
| BCM5974CKFBGH | Touch Controllers | ||||
| Fairchild | FDMC6676BZ | N-Channel FET | |||
| FDMC6683 | MOSFET | ||||
| Intel | 7990 | Unclassified | |||
| Micron Technology | MT29F1G08ABBDAMD-IT | 1 Gb SLC NAND Flash | |||
| Murata | PFBA | Likely antenna diversity switch | |||
| SWUA | Likely antenna switch | ||||
| SPM | Likely antenna switch | ||||
| Parade Technologies, Inc. | DP635 | LCD Driver | |||
| Qualcomm | MDM9600 | LTE Processor | |||
| PM8028 | Power Management IC | ||||
| RTR8600 | Multi band Transciever | ||||
| Samsung | K3P34E400E-XGC1 | DDR2 SDRAM | |||
| Skyworks | SKY77468-16 | Front End Module(PA+Duplexer) | |||
| SKY77469-16 | Front End Module(PA+Duplexer) | ||||
| SKY65513 (pkgmrk .1 13) | 2.5 GHz WLAN Switch LNA | ||||
| SKY65404 (pkgmak .4 31) | 5 GHz WLAN Switch LNA | ||||
| STMicroelectronics | L3G4200D | Gyroscope Sensor | |||
| 33DH | Accelerometer | ||||
| M24C16 | EEPROM | ||||
| Texas Instruments | 1BED8N | Unclassified | |||
| 1CLWI | Unclassified | ||||
| CD3240B0 | Other Power Controllers and Drivers | ||||
| QVP | Power Management IC | ||||
| TPS62260DRVR | DC-DC Converter | ||||
| Toshiba | THGVX1G7D2GLA08 | 16 GB MLC NAND Flash | |||
| Triquint Semiconductor | TQM7M5013 | GSM/GPRS | |||
| Unclassified | 1C15 | Unclassified | |||
| BG_DL | Unclassified | ||||
| K4 | Unclassified | ||||
| QRD01 | Unclassified | ||||
| T7380 | Unclassified | ||||
Could you put some information about the Microphone and speaker for the new IPAD.
It looks like the soldering on the chip is missing some connections!!!!
Yes it is. That is an artifact from the depot process where the acid has removed some of he solder balls in the center.
Could you put some information about the MEMS deviece for
the new IPAD
Hi, we have added a more complete BoM to this iPad 3 teardown. It includes the ST design wins for the inertial sensors.
Can you provide information about MEMs?
Before, Apple uses STM and AKM solution in the iPad 1/2 and iPhone, it does not describe what they are in the new iPad here.
In the iPad 2, those parts are not mounted on the main board. It is on another PCB board near LCD panel.
http://www.ifixit.com/Teardown/iPad-2-Wi-Fi-Teardown/5071/1 ; step 18
Hi, we have added a more complete BoM to this iPad 3 teardown. Similar to the prior generation, it includes the ST design wins for the inertial sensors and AKM for the electronic compass.
Hi Bob,
Many thanks for the information.
Hi Bill,
Sorry. One more question.
In the iPad 2, there is light sendor from TAOS, Inc. From the teardown provided bt iFixit, it is on the front camera module.
In the New iPad, i found there is a simmilar part in the front camera module. May i have your help to know whether you identify this component or not.
Thanks.
JJ Wu
Hi Bill,
Fyi,
iPad 2 from iFixit
http://www.ifixit.com/Teardown/iPad-2-Wi-Fi-Teardown/5071/3;
Step 20, 2nd picture.
iPad 3,
http://www.ifixit.com/Teardown/iPad-3-4G-Teardown/8277/4
Step 26, 2n picture
Light sensor is an importnat component that should impact the battery life of iPad.
Thanks.
JJ
Hello JJ>
We have seen TAOS (and others) light to digital converters in Apple and other products. There is very little information on these devices that allow us to ID who made the device. I will take a closer look and see if we can find new information which will help us ID who made this light to Digital Converter. Thx for reading
Jim
Hi Jim,
Thanks.
JJ
Hi Rob,
Sorry to keep asking about the MEMs.
I am curious on one thing. Apple design is always special.
I can not find those MEMs parts on the New iPad main board PCB as iFixit provides.
Are those MEMs parts on another PCB, like what Apple did on iPad 2?
Thanks.
JJ
Some were reporting that Triquent’s chip count was reduced from the iPad2, but after x-rays were made of the one big Triquint module it can be seen that there are 3 power amps inside this module where there were 3 separate PA chips on the iPad2 board. One might even say the chip count has increased because there are other supporting components inside this module. Of course, these would consume less energy etc. I also see you have a small list of unclassified Triquint parts. I don’t know what ‘unclassified’ means, but assume there are no identifying #s on them.
OOPS! I made a mistake. Unclassified must mean ‘unknown maker’ not what I originally said.
Hey all,
I am a university student taking a Microprocessor Theory & Application class. We have been tasked with writing a lengthy paper on the internal architecture of the iPad 3, and more specifically the CPU. Does anyone know where I could acquire more detailed information on the A5X processor?
Any feedback would be greatly appreciated!
Thank you.
Erik
(That doesn’t cost $5k)
Hi Erik,
The good news is that in the blog we have provided an extremely high resolution die photo which will help you with your analysis. The other good news is that it is 45 nm Samsung technology and that Samsung has published a number of articles and papers on their technology. The bad news is that we aren’t going to do your work for you and so you’ll need to do your own research for this paper. However, I can offer to have our process and circuit engineers review your draft content and offer tips or provide a SEM/TEM image or two to help you fill gaps. You can email us at insidetechnology@chipworks.com.
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