An exciting smartphone to recently hit the Chipworks labs is the Nokia 808 Pureview phone, referred to by Nokia as a game changer in terms of its groundbreaking image technology. The phone’s unique 41 MP sensor, manufactured by Toshiba, allows users to take photos with impressive detail, perhaps making the PureView a true 2 in 1 solution for a camera and smart phone. The primary camera also features a Carl Zeiss lens, PureView imaging technology (the first smartphone to feature this technology), and full HD video.
|When examining PureView’s comparably large size to most smartphones (4.9 x 2.37 x 0.55 inches), and its back protrusion (along the top) one could easily mistake the device for an actual camera. However, reviews indicate the phone’s curved back provides a comfortable feeling in the user’s hand. Furthermore, the trade-off of a slightly chunky phone for a high resolution image sensor may be well worth it to certain consumers requiring their mobile devices to capture high-quality images.
For those wondering what kind of a benefits a 41 MP smart phone image sensor can provide over the average 5 or 8 MP phone, DPReview points out that the Nokia 808 at standard resolutions is able to zoom without loss of clarity and capture 7 pixels of information, condensing into one pixel for extremely sharp images and, at high resolution, “has the ability to capture an image, then zoom, reframe, crop and resize afterwards to expose previously unseen levels of detail”.
Aside from the phone’s imaging capabilities, the PureView features:
(Some images sourced from nokia.com)
|Image Sensor – Toshiba HES9 CIS
The image sensor module is itself quite a piece of engineering (x-ray at right) and contributor to the overall phone dimensions. Not only does it contain the Carl Zeiss optical assembly, and the CMOS image sensor from Toshiba, but there is an Analog Devices chip which is in our labs for identification. The main devices behind the impressive camera functionality of the PureView are:
Further analysis on the Toshiba HES9 will be published early next week, as the device is still currently in being analyzed our labs.
Also shown, to the right, is a die size comparison of the Toshiba HES9 and the Sony IMX145 (the image sensor found inside the Samsung Galaxy S III smartphone).
Found inside a package-on-package (PoP) (shown on the right) was the Texas Instruments 4377622 1.3 GHz ARM processor. Package markings on the device include: 4377622/ RYAMA214/ 23ACYXW/ $N PL/ G1. (or was it a 4377621? well, that is crossed out by some enterprising editor at the packaging plant so we’ll assume the number above it is the more accurate)
Also found inside the PoP device along with the applications processor, was the Samsung KAT008DI5M mobile SDRAM. Package markings on the device include: SAMSUNG 149/ KAT008015M-AETT/ FI10919U.
Also found in the smartphone is another Toshiba device, the THGBM4G7D2JBAIM flash memory device. Package markings on the device include: TOSHIBA/ THGBM4G7D2JBAIM/ B92878/ JAPAN/ 1214KAE. A 128-Gb, 4-level MLC NAND Flash fabricated in an advanced CMOS process technology.
Along with the applications processor, Texas Instruments had many design wins in this smartphone, including the following:
One of the highly touted features of the phone is its audio capture capability so in relation to other smart phones, no expense was spared in there in choosing the TI chips.
Also found in the phone was the:
Analysis on Devices found in the Nokia PureView 808 Smartphone
Atmel MXTNOK1E Die Photo with die markings – contact us for details
Toshiba HES9 41 MP CMOS Image Sensor – contact us for details