Category Archives: Packaging

Sony out of the gate with ISX014 stacked camera sensor

Posted on February 13, 2013 by rwilliamson

  Much of the world is expecting to see stacked die technology from Sony in their latest Experia phone being showcased at the 2013 Mobile World Congress(and teased out at this years CES event).But why wait? From a technology standpoint, … Continue reading →

Posted in CMOS Image Sensors, Packaging | Leave a comment

Systems Analysis of the Apple Lightning to USB Cable

Posted on December 5, 2012 by rwilliamson

Systems analysis identifies how devices are used together – and may include testing of signals and software inside or between chips using sniffers, probing, data capture, or literature. Systems analysis, including software reverse engineering, is performed to identify evidence of … Continue reading →

Posted in Design Analysis, Design Wins, General News, IP News, Packaging | Leave a comment

The Luxtera CMOS Integrated Photonic Chip in a Molex Cable

Posted on December 3, 2012 by rwilliamson

contributed by R. Krishnamurthy Silicon photonics is not a new idea; there have been many attempts at commercial photonics devices back in the 90’s. However, despite some considerable R&D investments, commercial products have been few and far between, and to … Continue reading →

Posted in Advanced CMOS Technology, Design Wins, Packaging | Leave a comment

Sony’s PS Vita Uses Chip-on-Chip SiP – 3D, but not 3D

Posted on July 5, 2012 by Chipworks

At the tail end of last year Sony released their PlayStation Vita, and it was duly torn down by iFixit and others.  In due course we took it apart too, though we didn’t post it on our teardown blog. Inside … Continue reading →

Posted in Design Wins, Packaging | 9 Comments