Die Photos
The first step in a reverse engineering project is almost always an examination of the die. Top-level analysis can be gleaned by comparing publicly available process information with die size and block make-up.
In addition to low pricing and same-day availability, Chipworks die photos are superior because they are not simply a single field image at low magnification, nor a collection of separate high magnification images. They are taken at (typically) 10x – 20x optical magnification, then aligned and seamlessly stitched together into a single floor plan. This creates large images (often >50 MB) that can be navigated as though the user had a microscope on his/her desktop.
»Die photos are available in the Chipworks Report Store at top metal and lower metal/poly.
»Clients can contact us to custom order images at any layer of the device.
Recent die photos in the Chipworks Report Store |
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Sample 1 Top metal die photo from a 1 µm BiCMOS-DMOS device (low res 4.7 MB) |
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Sample 2 Poly die photo from a 40 nm graphics processing chip (low res 10.8 MB) |
Die photos are shipped with die mark images and documentation describing manufacturer, part number and die size.