Exploratory Report
Chipworks’ exploratory reports communicate key device information, resulting from exploratory work such as an approximate identification of process generation, pixel size for image sensors, or special/interesting device features. These reports help provide a better understanding of competitors' technologies and allow multiple competitors to be tracked cost effectively.
Content varies by device type, but information typically includes:
- Package and die overview, including a package x-ray
- Initial SEM and/or TEM analysis of general and key structures
- Optional delayered die image