Functional Analysis Report – Basic
Chipworks' Functional Analysis reports focus on a device's floor plan and block level functionality, to give you an architectural understanding of the die. This knowledge, in conjunction with basic process information, can then be used as a benchmarking tool to perform a high level cost analysis.
A basic functional analysis includes a basic look at the layout to learn node and architecture. It is used to determine if further analysis is warranted, and to keep tabs on a large number of competitors.
These reports contain the following detailed information:
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Package photographs
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Package x-ray
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Depot (bare die) die photo
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Metal 1 or polysilicon die photo
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Digital, analog, and memory are annotated
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Die size measurements
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Cross section photo
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Node assessment (metal 1 pitch, transistor measurements, ITRS assessment)
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IC cost estimate
Download a sample report (5 MB) »