Layout Analysis – Analog Block Analysis
This report provides an overview of an IC’s analog blocks using detailed board, package, x-ray, literature, and layout analysis to name the analog blocks used on a chip, and the sizes of each. Clients use this information to compare their own designs and determine if their competitors use different or smaller functional blocks. This helps to allocate R&D resources and to determine when further analysis, such as circuit extraction, is warranted.
These reports contain the following detailed information:
- Package photographs
- Package x-ray
- Depot (bare die) die photo
- Die size measurements
- Annotated metal 1 or poly die photo showing the major analog physical blocks on the die
- Zoomed-in views of each analog block on the metal 1 or polysilicon layer
- Analog block measurements
- Discussion of functions of each analog block
- Blocks are identified based on layout analysis and publicly available information (datasheets, technical papers, etc.)
- Table summarizing the length, width, area, and percentage die area of each block
Download a sample report (7 MB) »