Process Analysis - Embedded Memory
At the smaller geometries, the ability to effectively scale embedded memory has become a differentiator for foundries and a real R&D challenge. The Process Analysis – Embedded Memory report format provides specific and customized analysis that delivers the highest ROI when looking specifically at these regions on a die. While analysis of the general logic is included, this report format does not provide a full characterization of its lithographic features.
These reports contain the following detailed information:
- Annotated die photograph showing embedded memory block(s)
- Cross-sectional analysis through the eMemory – Flash, SRAM, DRAM, etc.
- SEM/SCM analysis of all dielecric levels, metal levels, transistors, poly and isolation, wells and substrate of the memory cells
- TEM of memory cells – when below 100 nm
- Plan-view images at metal 3 to diffusion
- Schematic of memory cells
Additional analysis may include (optional):
- Materials analysis
- TEM of memory (>100 nm generation)
Download a sample report (27 MB) »