Imager Process Review
This report also provides a thorough cross-sectional analysis of the general logic and pixel to help understand how the sensor is fabricated. The focus is on the elements specific to image sensors such as microlenses, color filters, pixel architecture, and photocathode. Analysis of the pixel is parallel and perpendicular to the column outline, to show the structure of the pixel array elements. Detailed images focus on the aperture, transistor gate structure, anti-reflective coatings, and photocathode.
The cross-sectional analysis includes TEM imaging to highlight the gate oxide thicknesses, transistor gate structure, and back-end processing in the pixel array. SCM and SRP analyses of the doping profiles in the pixel array are included.
And finally, the Imager Process Review includes a schematic of the unit pixels, or shared pixels if applicable. A plan-view analysis shows the pixel layout from the microlens level, through the metal and poly levels, and the silicon surface to show the diffusions.
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