MEMS Package Analysis
The MEMS package analysis provides details on the packaging technology used with measurements of key features. It is used by clients to identify new innovations and develop cost models. Contents include:
- X-ray of package showing cross section
- Summary of key dimensions
- Optical images of package cross section (optional)
- SEM cross-sectional image through MEMS cavity
- SEM cross-sectional image of ASIC die
- SEM image showing package thickness
- SEM image showing die placement
- SEM image showing die thickness
- SEM image showing cavity height
- SEM image showing proof mass
- SEM images of other interesting features such as bond pads and seal
MEMS Package Analysis Sample Report »