CMOS Back End (BEOL) Analysis
This report provides a TEM-based analysis of the back end of line (BEOL) fabrication for CMOS technologies. This analysis delivers SEM, TEM, and material analysis to provide an understanding of transistor design.
Report contents include the following detailed information:
- SEM and TEM cross-sectional analysis of dielectrics, metals, and vias
- Materials analysis results for metals and dielectrics
- Critical dimensions
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