CMOS Overview Analysis
This report provides an overview of advanced CMOS devices and is frequently used to keep abreast of multiple competitors and to determine whether further analysis of a specific device is required.
Report contents include the following detailed information:
- Package photographs, package X-rays, die, die marking photographs and die features photographs
- SEM general structure, minimum metal 1 and minimum contacted MOS
- Critical dimensions table with minimum metal 1, minimum MOS gate length and minimum contact gate pitch
- Determination of technology node based on SEM cross section
Download a sample CMOS Overview Analysis