Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

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IBM Continues to be a Major Source of Chip Innovation, Despite Rumours It May Exit the Business

Contributed by: Sinjin Dixon-Warren IBM’s Semiconductor Division and Intel have been two of the primary drivers of advanced CMOS development for nearly fifty years. Although Intel has usually been first to market with a new technology node, IBM has continued to be a major source of innovation in advanced CMOS technology over the past decades. [...]

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Intel’s e-DRAM Shows up in the Wild

Contributed by Dick James When Intel launched their Haswell series chips last June, they stated that the high-end systems would have embedded DRAM, as a separate chip in the package; and they gave a paper at the VLSI Technology Symposium [1] that month, and another at IEDM [2]. It took us a while to track [...]

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Samsung 28 nm HKMG Inside the Apple A7

Contributed by: Sinjin Dixon-Warren The Apple A7 processor used inside the iPhone 5s represents an extraordinary piece of engineering. Some details, such as the die layout, were discussed in an earlier blog. The A7 is fabricated with Samsung’s 28 nm low power (LP) gate first, high-k metal gate (HKMG) process technology. The process features nine [...]

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IEDM 2013 Preview

Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2013 IEEE International Electron Devices Meeting.  To quote the conference web front page, “IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, [...]

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A Look at Sony’s Playstation 4 Core Processor

As I start to write, we’re ripping apart the Sony CXD90026G die to try and get a floorplan and see what’s in there. However, before we get to that, let’s have a closer look at what was in the box. Underneath the mother board was a piece of tinplate with numerous holes cut in it, covering [...]

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GLOBALFOUNDRIES to make Apple chips in New York fab?

Contributed by Dick James I normally don’t have the time to follow local press, but occasionally Google Alerts pops up with something quite interesting. In this case, the Albany Times Union from Albany, New York had an intriguing headline that supports some of the gossip around Apple’s fabrication plans for their A-series processor chips, up [...]

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