Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

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ISSCC 2013 – Monster chips from IBM, Oracle and AMD

contributed by Randy Torrance Hot on the heels of a “cores, cores everywhere cores” blog created at the Mobile World Congress, we have an alternative view of the world coming from the International Solid State Circuits Conference.  And it isn’t about power savings and 1080p performance. It is horsepower.  Heavy duty, pile driving, cast iron [...]

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MWC 2013 – Cores, Cores, Everywhere Cores

Contributed by Rob Williamson A comparative look at a few of today’s flagship application processors Walking around Mobile World Congress, you can’t help but notice that the leading smartphone vendors are down-playing their specifications these days. In the early days of smartphones, the spec sheets ran like a detailed comparison of PC specifications from 1993.  [...]

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ISSCC 2013 Heterogeneous Systems Architecture

Contributed by Randy Torrance For years, ISSCC has been known as the conference that is just about the facts. Papers were only accepted if silicon was available (the requisite die photo as your last slide). No marketing was allowed, and all slides had to be on a plain white background. This while the rest of [...]

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Looking at the Wii U Graphics Processor

Yes, even reverse engineering the latest technology has its up and down days. At the start of the reverse engineering process, we generally have a simple electronics teardown before we can get to the more traditional tasks of helping our clients understand the process technology or circuit design of a chip. The routine of getting [...]

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IBM surprises with 22nm details at IEDM

Monday afternoon last week at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology [1], aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and dual-stress liners for both NMOS and PMOS [...]

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Intel’s 22-nm Tri-gate Transistors Exposed

Contributed by Dick James Last week Intel had their Q1 conference call for financial analysts, and revealed that the 22-nm Ivy Bridge parts would make up 25% of their shipment volume in the second quarter of this year.  That means that a good quantity will already have shipped, and we managed to track some down [...]

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