Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

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Sony out of the gate with ISX014 stacked camera sensor

  Much of the world is expecting to see stacked die technology from Sony in their latest Experia phone being showcased at the 2013 Mobile World Congress(and teased out at this years CES event).But why wait? From a technology standpoint, the event is now (or rather as of a few weeks ago) old news.  We [...]

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Systems Analysis of the Apple Lightning to USB Cable

Systems analysis identifies how devices are used together – and may include testing of signals and software inside or between chips using sniffers, probing, data capture, or literature. Systems analysis, including software reverse engineering, is performed to identify evidence of use in support of patent licensing and litigation. It can also be used for competitive [...]

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The Luxtera CMOS Integrated Photonic Chip in a Molex Cable

contributed by R. Krishnamurthy Silicon photonics is not a new idea; there have been many attempts at commercial photonics devices back in the 90’s. However, despite some considerable R&D investments, commercial products have been few and far between, and to our knowledge, integration of silicon photonics with advanced IC technology on a die has never [...]

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Sony’s PS Vita Uses Chip-on-Chip SiP – 3D, but not 3D

At the tail end of last year Sony released their PlayStation Vita, and it was duly torn down by iFixit and others.  In due course we took it apart too, though we didn’t post it on our teardown blog. Inside we found the usual set of wireless chips, motion sensors, and memory, but the key [...]

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IEDM 2011 – IBM Displays Via-Middle TSV Process for Die Stacking

A few days after IBM and Micron publicised their hybrid memory cube, IBM gave their TSV paper at IEDM on the Monday afternoon (paper 7.1).  Entitled “3D Copper TSV Integration, Testing and Reliability”, they described a node-agnostic TSV (through-silicon via) technology which takes a via-middle configuration, making contact to the upper metal (fat-wire) layers in [...]

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Counterfeit Elpida DRAMs Identified by Chipworks – Samsung Inside!

Contributed by: Dick James  I was recently checking out the Elpida website, and there on the front page is this announcement – “Concerning Counterfeit DRAM Products”, and a click-through to an announcement warning of Elpida-marked DRAMs that turn out to be counterfeits with associated performance and quality problems.  This struck a chord, since we recently [...]

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