Need help with systems or software patent licensing?Teardown of the Casio Exilim EX-FH100
Semiconductor innovation is alive and well in consumer electronics
With the most recent two teardowns we have profiled (the iPad and the Google NexusOne) we found little to get really excited about regarding semiconductor innovation. Don’t get us wrong, there were high performance chips in there, just not the sort of stuff that gets process technology junkies really enthralled.
Normally, we are used to finding more hot semiconductor technology and so we decided to take a look at the dozens of teardowns that have hit our labs recently to write this next teardown. It didn’t take long to find a “simple” consumer point and shoot that fit the bill – the Casio Exilim EX-FH100. It has the perfect combination on mass-market pizzazz and, frankly some very sophisticated semiconductors.
To order the die photos described in this teardown, please contact insidetechnology@chipworks.com.
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First – the press bits about the cameraThis 10.1 effective megapixel high-speed digital camera boasts a wide-angle 24 mm 10X optical zoom lens in a compact body that makes it easy to carry anywhere. It also gives users a maximum burst rate of 40 shots per second for still images (maximum image size of 9.0 megapixels and maximum shooting capacity of 30 shots) that can now be used to photograph distant subjects thanks to the high-power zoom. To be honest, at a price point under $400 this sounds like a pretty sweet camera. But we aren’t camera reviewers and we’ll be getting that information on DPReview.It also enables up to 1,000 fps high-speed movie recording that captures motion that is ordinarily too fast for the human eye to see. If you don’t believe this, check out some of the cool Exilim high speed videos on YouTube . |
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InsideIn removing the cover we see the main board features a Sony CXD4122GG Image Processor and a few other interesting tidbits that we will cover later. |
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Taking out the Image SensorUnderneath the lens area we can pull out the image sensor. It seems to be a standalone sensor with no major on-board processing (i.e. a system on chip often found in camera phones) as would be expected in a point-and-shoot camera. |
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Sony Image SensorLooking at the back we see the marking 50C. This along with the die markings, specifications, and a bit of lab work confirm it to be the first highly innovative feature of the camera. This is a second generation backside illuminated sensor from Sony and represents the state-of-the-art in CMOS image sensor technology. Our image sensor analyst has already contributed a blog on the Sony IMX050 This image sensor chip carrier contains embedded passives to save real estate – something the entire semiconductor industry has been hotly pursuing.It is indeed a standalone sensor – you can read more on this sensor and the image processor in our blog |
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The backside of the boardThe camera main board shows a fairly straightforward microphone (no MEMS device here) and our first clue to some of the latest technology. You are also able to see the inputs for the USB and HDMI, as well as the mechanical slot that houses the memory card. Removing this shows us the silicon of interest. |
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Underneath the memory card slotStill on the backside (as we have called it) there are 2 chips of note. The first being a 4Gb SDRAM, manufactured by CHIPSIP. The CT83962C1 is a high-speed 32-bit DDR2 SDRAM, helping the continuous shooting and slow-motion capability of the camera. X-rays of the package show us that there are 4 x 1-Gb dies in there, and de-capsulation clarifies that CHIPSIP are using Winbond SDRAM. When we investigate further, we find that these particular parts are really interesting, because they contain buried wordline technology – the first metal-gate DRAMs since the early ’70s! This technology was developed by Qimonda, and licensed by Winbond before Qimonda ceased operations. Once again, the state of the art in this technology category.The second chip of note is the Toshiba 1 Gbit NAND Flash device. This memory is fabricated at 43 nm and while not the absolute latest technology is impressively small. The Flash market tends to lead the way in shrinking its technology.The third interesting device is the Analog Devices ADV7523 Ultralow power HDMI transmitter. |
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Over on the front sideSony’s companion to the image sensor is a brand new image processor, the CXD4122GG with the brand name Exmor.You can also see the Renesas R2A30425 Autofocus/Zoom motor driver. |
| There were a few other interesting chips that we couldn’t quickly identify. If you have any ideas, please let us know. | |
To order the die photos described in this teardown, please contact insidetechnology@chipworks.com.
Several semiconductor reverse engineering reports are available on technology found in the Casio Exilim EX-FH100
Sony IMX050C 2nd generation BSI CMOS image sensor Imager Process Review (IPR-1004-802)
Sony IMX050 chip carrier with embedded passives Package Analysis Report (PKG-1005-802)
Winbond DRAM with buried wordline technology in CHIPSIP package Process Review (PPR-1005-802)
Winbond DRAM wth buried wordline technology Circuit Analysis on Memory Sub Array (CAR-1005-809)
Sony Exmor CXD4122GG Process Node Assessment (PNA-1005-801)
Toshiba 43 nm (Sandisk 03433-004G) NAND Flash Structural Analysis Report (SAR-0810-101)
Visit the links or contact us for ordering information.
