Chipworks

The 5 Mp CMOS image sensor is new to the 3rd gen iPad, but is it new to us? It is very likely that Apple has recycled the 5 Mp back illuminated CMOS image sensor from the iPhone 4. That unit was the Omnivision OV5650. The OV5650 is the second generation back illumination (BSI) technology from OmniVision.

(clarification added March 19, 2012 – this is second generation BSI-1 with noted improvements over the first BSI-1 sensor we analyzed. It does not have the full feature-set consistent with BSI-2 and OmniVision does not market it as such)

This 5 Mp camera features 1.75 µm pixels, and is designed to deliver DSC quality in a mobile phone application. The sensor supports 720p HD video at 60 fps and 1080p at 30 fps. Apple specifications for the new iPad also tout the same specification. So the analysis we have just completed . . . drum roll please . . . says that the 5 Mp back illuminated CMOS image sensor in the new iPad is the same, it is the Omnivision OV5650 (die markings OV290BF). Yet again, Apple is recycling as many devices as they can to produce this new iPad. This is a very smart technique that keeps their costs and technological risks low. Apple would have placed large orders for this camera to build the iPhone 4 and now again for the new iPad, so hopefully they are leveraging these volumes to get a low unit price per camera.

Chipworks conducted a full analysis of the OV5650 when it first appeared in the iPhone 4. We have an Imager Process Review as well as die photos on this device in the Chipworks Store.

The secondary CMOS image sensor inside the new iPad is also a design win for Omnivision. This camera, the OV297AA, is a 0.3 Mp, 3.0 µm pixel pitch CMOS image sensor. Chipworks has seen this on the iPod Nano and the iPad 2.

The A5X in the new iPad was a bit of a surprise to us in that in previous iProducts using the A5 and A4 processors, that processor was configured in a package-on-package (PoP) assembly, whereby the LP DDR2 SDRAM sat on top of the A processor. In the new iPad, the A5X sits on one side of the motherboard and the twin Samsung LP DDR2 SDRAm (qty 2) sat on the other side of the motherboard. Of note is the recurring theme of Apple dual sourcing DRAM. The unit iFixit purchased in Australia utilized Elpida LP DDR2 and our unit utlized Samsung LP DDR2.

The A5X part number is APL5498 and the die markings repeat that same number as well. The balance of die markings indicate Samsung being the foundry for this processor (we really did not expect to see TSMC making the A5X, but one never knows). The A5x die measures 12.82  mm x 12.71  mm for an area of 162.94 mm². Compared to the A5 which measures 10.01 mm x 11.92 mm for an area of 119.32 mm². That is an increase in the die area by 36.5%! A fairly large increase to accommodate the dual-core CPUs  and quad-core graphics processor.  This indicates that Apple stuck with Samsungs’ low power 45 nm CMOS process. Our cross section is in progress now, so we’ll know soon enough when we can measure the contacted gate pitch.

Working across the front side of the mother board from left to right, we see the WiFi SoC being used is the BCM4330. The BCM4330 has been observed before in many smartphones in the second half of 2011, and looks to be another huge winner for Broadcom. (Click here for free die photo of the Broadcom BCM4330)

To the right, we have two Elpida low power DDR2, combining to give us 1 Gbyte of SDRAM. This part number is not so new to us. We need to take a look at the die markings to determine the process generation. The package markings indicate it was packaged at the very end of 2011, so we may have a new device.

Based upon the package markings and the pin 1 identifier, this device is the Cirrus Logic audio codec. Cirrus Logic has been in Apple products for a very long time. It is no surprise to see them again. It appears to be the same Cirrus Logic audio codec used in the iPhone 4S, the 33S0987.

The LTE function is new for Apple, but LTE chipsets have been deployed elsewhere, and Apple has gone with chipsets that have been used in other devices. The LTE solution is the Qualcomm MDM9600 Gobi LTE processor, together with the RTR8600 multiband RF transceiver for LTE. Part of the RF section is the RF power management. This function is being served by the Qualcomm PM8028. On the right hand side of the board, we see a new Toshiba device (package marks: Toshiba logo, CHINA, YOAOOO11419KA) which is a memory MCP from Toshiba that is used in conjunction with the LTE processor. We have observed Toshiba MCPs in Motorola 4G LTE phones throughout 2011 and into 2012.

The entire RF front end, LTE, and all of the other bands are made up of devices from Skyworks, TriQuint, Avago, and Murata, to name a few. The radios are complex, with a lot of devices and switches. We will be looking at this more closely in the next few days.

On the back side of the motherboard, we see the power management IC which looks nearly identical to what we have observed in the iPad 2 (Apple 343S0542-A2), thus making this a Dialog Semiconductor PMIC, and maybe even carries a female name beginning with the letter “A.” Theses PMICs, if you have not been following, have all been named (die markings are women’s names beginning with A: Ashley, Angelina, Alison, etc.). Care to guess what this one will be called?

Have your cake and eat it too

The Pantech Element is a 4G LTE tablet featuring the Android 3.2 Honeycomb operating system and a waterproof design (a new tablet trend we also saw at CES 2012).

AT&T also introduced this tablet purchased together with a Pantech Burst smartphone for $250 (with contract). Really a great bundle deal when looking at the specs for this tablet. What is inside compares favorably with the market leaders when considering price. Along with a 1.5 GHz Qualcomm S3 Snapdragon CPU, this device also features Vivid HD 1024×768 resolution (160 ppi) on an 8” screen, 1 GB of RAM and 16 GB built-in storage, 5 MP rear-facing camera with flash, and a 2 MP front-facing camera. The Pantech Element also supports an impressive number of video formats, including H.263, H.264 AVC, MPEG-4, VP8, VC-1 (WMV), and DivX®/XviD®.

Considering the relatively low price cost of this tablet, we were impressed by the Element’s list of features, and thought there would be only small compromises on specs for the price. When diving down to the silicon level of this tablet, we were interested to see the silicon inside and compare the tablet’s chips to those of more expensive devices already on the market.

Qualcomm Snapdragon S3 dual-core mobile processor (APQ8060)

The  APQ8060 applications processor is the third generation Snapdragon mobile processor by Qualcomm. This device includes the industry’s first asynchronous SMP dual-core CPU design, delivering superior performance and power optimization for  high-tier mobile devices, particularly for mobile entertainment and gaming devices. A key device inside this chip is the HG11-VN530. We have seen this inside the Qualcomm MSM8660, so this die serves more than one product line. Between the APQ8060 and the MSM8660, we have seen this die  cataloged in over 35 products including recently the Pantech P9070, Pantech P4100, and HP Tab HSTNH-129C.

Package markings on this device include: Qualcomm logo/APQ8060/1AA/BCV117.0/C114601. (apologies for the image, but we cracked this one during depot).

Other Qualcomm devices

Along with the Snapdragon S3 applications processor, Qualcomm was a big winner with its chipset in the Element tablet, including:

• The Qualcomm MDM9200 wireless device. The MDM9200 is the industry’s first integrated multimode, single chip 3G/LTE solution and supports both FDD and TDD modes of Category 3 LTE. Package markings on this device include: Qualcomm logo/ MDM9200/AAR416.0/E1146002.
• The Qualcomm QTR8615 device. The QTR8615 is an RF subsystem with integrated Bluetooth and FM radio UMTS/DOrB LTE RF+codec. Package markings on the QTR8615 include: QTR8615L/ACT316.0/C51460A7.
• The Qualcomm WCN2243 Bluetooth device. The WCN2243 is an FM/Bluetooth SoC found in the Pantech Element, which supports Bluetooth® 2.1+EDR technology. Package  markings on the device include: WCN2243/PAR980G3/C116005.
• The Qualcomm PM8028 power management IC, PM8901 power management IC, and PM8058 power management IC were also found in the Element.

But they aren’t done yet…

…enter the Atheros AR6003 WiFi SoC

The Atheros AR6003 is the third generation Wi-Fi chip on the Atheros ROCm (radio-on-chip for mobile) platform. The AR6003 is the most power efficient 802.11a/b/g/n WLAN implementation for mobile and embedded applications, and features the smallest WLAN footprint for design flexibility (qca.qualcomm.com).

For a free high resolution top metal die photo on this part, please visit the Chipworks Report Store

Delivering the goods to the touch screen

The high brightness LED driver is the Texas Instruments TPS61165DRV. Click the link, because we’ve delayered it, and are offering a free metal 1 die photo in our Report Store.

It features a 40-V integrated FET, and is a boost converter for driving LEDs in series. It is targeted at LED lighting and WLED backlighting for medium form factor displays. Package markings on the device include: CCQ/IB1/A5Y5.

Also found inside the tablet is the Atmel MXT768E touch screen controller. For new readers to our blog, Atmel is far and away the leader in this space in terms of design wins. From what we have seen, they are also the innovation leader. Being in first place is good.

Atmel touts the part as the industry’s first 32 bit single chip capacitive touch screen controller for tablets up to 12 inches, with support for unlimited touch sensing on 768 channels.

Package markings on this device include: Atmel logo/MXT768E/CU 1R1/1134G TW/D5R7R.A.

Notably, the die is the exact same as the MXT540E that delivers different specs.

MEMS devices

The InvenSense MPU3050 three-axis gyroscope sensor was another device  found inside the Pantech Element. This device was also found in the Asus eeePad Transformer. Package markings on the device include: INVENSENSE/MPU-3050/D1V179-K1/EI 1140 K. For fun, we thought we would show you (at right) what a MEMS device looks like with the cap still intact.  MEMS gyroscopes are hermetically sealed, and their functionality depends on vibration of a proof mass in a controlled low pressure environment.

The Bosch BMA220 accelerometer was another MEMS device found inside the tablet. In contrast to the gyroscope, we’re taking you inside further. The BMA220 is an ultra small triaxial, low-g acceleration sensor with digital interfaces, aiming for low power consumer market applications. Package markings on this device include: 1PP/8A.

There is also an interesting IP story of sorts because Hasbro, the makers of the Transformers Optimus Prime robot toy are suing Asus for trademark infringement. We wonder if there is a functional Optimus Prime Robot that we can reverse engineer to look for electronics patent hits on IP that Asus owns.

And finally, the silicon itself. And there are at least four interesting stories to be discussed: the processor, the touch screen controller, the WiFi chip, and the primary camera.

We don’t tend to speculate on what blocks are what without providing specific evidence so we’ll be looking more closely at this chip in a Functional Analysis Report.  When compared to the Tegra 2 (at right), we see a lot of differences in layout, although the ratio of the die allocated to analog and digital blocks is very similar. (low resolution provided)

The BCM4329 when compared the the BCM4330, is a larger die and does not use Bluetooth 4.0.

Atmel’s marketing bumph calls the mXT768E, “the industry’s first 32–bit single–chip touch controller for tablets and other large screen applications up to 12–inches. Based on Atmel’s ultra–low–power 32-bit AVR architecture, the mXT768E meets the increased demand on signal processing needed for rejecting unintended touches and maintaining responsiveness on large screens. The mXT540E and mXT384E devices, also based on the advanced 32–bit AVR architecture, offer system designers the right price–to–performance selection for their touchscreen designs, and are appropriate for smaller tablets, e–book readers and high–performance smartphones.”

So the same die performing to different specifications.  This does not look like a case of binning because when you examine the bond pads in the die photos, the 768E has a number of pads with wire bonds that are not bonded in the 540E.  This approach lets Atmel incur only one set of design and die manufacturing costs, while delivering different price-performance parameters to clients. It makes good sense in many cases.