Archive for the ‘Design Analysis’ Category

Circuit highlights from the Texas Instruments WiLink 7.0 (and more)

Monday, April 30th, 2012 by rwilliamson

The Texas Instruments WL1283 (WiLink 7) is a topic on which we have written in the past.  It is a multi-band chip with an impressive set of specifications, in a small size that competes with the market leader, the Broadcom 4330. Each brings their own set of specifications to the table with the TI device supporting GPS natively while the Broadcom device promotes Bluetooth 4.0 compliance.

However, it was interesting to note  that in reference to the Bluetooth functionality, Texas Instruments’ spec sheet touted “best in class RF performance” and  “Bluetooth 3.0 and Bluetooth Low Energy support”. But wait a minute… isn’t Bluetooth LE a hallmark feature of the Bluetooth 4.0 specification? Confused? So were we.  What it means is that the WL1283 is implementing classic Bluetooth and low energy Bluetooth, but not Bluetooth HS.  What matters is that the WL1283 device targets a high volume socket that delivers a lot of advanced capabilities to the latest smart phones at a competitive price.  And with the performance touted we thought we would look a little deeper at the Bluetooth block. The full reports can be ordered here.

Enter, something new for Chipworks – Circuit Analysis Videos. These short videos feature, engineer-to-engineer discussion of  one or two interesting blocks from leading devices targeted more at circuit designers than product managers or process R&D teams. For the full YouTube channel visit

http://www.youtube.com/user/ChipworksCorp/videos

Design analysis of the Texas Instruments TPS62260 DC-DC converter

Wednesday, October 12th, 2011 by chipworks

Contributed by Randy Torrance.

For this blog, we are starting a new category of content called “Design Analysis.”  This area will be focused on content most useful for design engineers or for patent teams that are interested in chip circuitry. It will ultimately be comprised of both standard articles and vBlogs that walk through some of the circuitry contained in our most recent analyses. First up is a DC-DC converter found in a high volume tablet.

The Texas Instruments TPS62260 is a highly efficient synchronous step-down DC-DC converter, optimized for applications including cell phones, smartphones, PDAs, pocket PCs, WLAN and Bluetooth™ applications, DVB-H tuner applications, portable hard disk drives, and DC-DC micro modules. This device was found in the Apple iPad and iPad 2 (Figure 1).

Figure 1. Texas Instruments TPS2260 (top centre) on Apple iPad PCB

With a wide input voltage range of 2 V to 6 V, the TPS62260 provides up to 600 mA output current from a single Li-ion cell, two and three alkaline batteries, or 3.3 V and 5 V input voltage rails. The TPS62260 operates at a 2.25 MHz switching frequency using PWM, and enters the power save mode operation at light load currents using PFM, to maintain high efficiency over the entire load current range.

The TPS62260 is fabricated using a three metal, double poly, 0.5 µm BCDMOS process, including an interesting single poly EEPROM cell. The die size is 1.45 mm by 0.86 mm (Figure 3). It can be mounted in either a very small 2×2 6 pin SON or a TSOT-23 5 pin package.

Figure 2. Texas Instruments TPS62260 die markings

The TPS62260 step-down converter integrates the high side and low side power switches on-chip. Interestingly, TI has chosen to use an NMOS transistor for the high side switch, rather than the traditional PMOS. Using an NMOS switch improves efficiency and reduces the switch die area due to the higher transconductance of the NMOS transistor. In fact, the NMOS high side switch is actually smaller than the low side switch. However, this architecture requires a charge pump in the gate driver to fully turn on the NMOS high side switch, which adds some complexity and area. Figure 3 shows the TPS62260 die photo at the polysilicon layer, with the high side switch highlighted in white along the top (six multi-finger transistors), and the low side switch highlighted in white along the left (also six multi-finger transistors). It’s clear that quite a bit of area has been saved by using an NMOS high side switch.

Figure 3. Polysilicon die photo showing high side and low side switches

Another interesting feature of the TPS62260 is that it employs a small nonvolatile memory for trimming purposes. The trimming can be performed both on the wafers during manufacturing and after packaging. TI’s novel EEPROM cell contains two floating poly gates, each includes a small tunneling capacitor and a fork-shaped programming capacitor (see Figure 4). When a pair of high voltage write/erase control signals are applied to the two diffusion regions under the two sides of the poly gate, the smaller tunneling regions either attract electrons from the substrate to the floating gate, or repel the trapped electrons from the floating gate, hence a “write” or “erase” is performed. We extracted this circuit and found a compact differential EEPROM cell structure (Figure 5). The high voltage required for programming the EEPROM cells is provided by a high voltage generator where four Pelliconi stage cascade voltage pumps are used. Long channel extended drain transistors (also visible in Figure 4) are used to route the high voltage to the cells. Similar single poly EEPROM cells have been found by Chipworks in other Texas Instruments devices, such as the TPS62601 6 MHz 500 mA synchronous step-down DC-DC converter and the TPS61181 WLED driver.

Figure 4. Differential EEPROM cell and high voltage transistors

Figure 5: Differential EEPROM schematic, with the cell on the left and the high voltage programming path on the right

The full analog Texas Instruments TPS62260 Circuit Analysis Report also presents the following functional blocks of the device:

  • Feedback input
  • Error amplifier
  • Sawtooth generator
  • PFM comparator
  • PWM comparator
  • Reference generator
  • Thermal shutdown
  • Input circuits
  • Power pin ESD
  • Trimming circuits
  • SW monitors
  • Control logic
  • Current limitations
  • Gate driver
  • SW shaping
  • SW LPF

And shown in Figure 6 is a top level schematic of the TPS62260.

TI TPC62260 Circuit Analysis

Figure 6. TI TPS62260 top level circuit schematic shown in the ICWorks Browser. Click image to enlarge.

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