Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

Patent knowledge. Technology expertise. Market understanding.

Report Formats

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Chipworks' reverse engineering is delivered in a standardized report format that maximizes the amount of information at the lowest possible cost to the client

Published reports are also designed to be highly configurable, so you get the information you need from modules or chapters from the full reports.

  1. Basic Benchmarking

    Die Photos
    Process Node Assessment
    Exploratory Report

    Circuit Extraction and Analysis

    Hierarchical Organized Schematics  
    DRAM Sub-Array Circuit Analysis Report                    

    Die Utilization

    Layout Analysis – Floor Plan
    Layout Analysis – Analog Block Analysis           
    Layout Analysis – Embedded Memory
    Layout Analysis – Gate Count
    Layout Analysis – I/O
    Functional Analysis Report – Basic
    Functional Analysis Report – Standard
    Functional Analysis Report – Advanced

    Other Analysis

    Process Flow Analysis
    Transistor Characterization
    Package Analysis

     

    Structural analysis – Advanced CMOS

    Module 1 - CMOS Overview Analysis
    Module 2 - CMOS Logic Front End (FEOL) Analysis
    Module 3 - CMOS Back End (BEOL) Analysis
    Module 4 - CMOS SRAM Analysis
    Structural Analysis - FEOL
    Structural Analysis - Standard
    Structural Analysis for Advanced Node CMOS

    Structural Analysis – Memory

    DRAM Process Report
    Flash Process Report
    Embedded Memory Process Report

    Structural Analysis – Power

    Structural Analysis – Advanced Power 

    Process Analysis – MEMS

    MEMS Overview Analysis
    MEMS Package Analysis
    MEMS Architectural Analysis (ICWorks Surveyor)
    MEMS Process Review

    Process Analysis – Image Sensors

    Image Sensor Overview
    Image Sensor Pixel Planar Analysis
    Image Sensor Pixel Cross-Sectional Analysis
    Imager Process Review