Embedded Memory and Emerging Memory Technologies

Embedded memory (eMemory) is major technical obstacle for the semiconductor process and circuit design teams. The challenges associated with designing eFlash and eDRAM at the latest geometries has resulted in the process technology lagging the CMOS logic technology by at least one generation. Additionally, the ability for microcontrollers (the chips most associated with embedded non-volatile memory (eNVM)) to scale has been held back by the limiting factor of eMemory.

Leading foundries are designing and shipping eMemory processes for the latest 65 nm and 90 nm technology and are investing heavily to solve the problems at 45 nm and 32 nm nodes. Leading semiconductor companies benchmark against their toughest competitors to help lower the R&D costs and reduce the risk of billion dollar long-term investments. By scaling faster, these companies earn millions with lower cost, higher performance devices.

In addition to traditional memory technologies some companies are touting the future of emerging non-volatile (NVM) technologies like Magnetoresistive (MRAM), Phase Change (PCRAM) and Ferromagnetic (FRAM). While these technologies are largely a standalone niche market at this time, their long term potential has attracted significant R&D investment. Senior process managers looking to get into these emerging technologies can reduce their risk by leveraging Chipworks analysis.

Red arrow Show the latest eMemory and emerging memory reports

Red arrow Show the latest emerging memory technology reports

Report Types Typically used by Clients in Process Design

Red arrow Structural Analysis Report: Detailed structural process analysis including TEM, SEM, and materials analysis of the device. This report includes minimum observed features, high-level floor plan layout, analysis of memory density and cell size estimates.

Red arrow Process Review – Advanced CMOS FEOL: A reduced-scope report that provides critical information on the Front End of Line process technology of a device along with a basic characterization of the overall process.

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