Publications
Chipworks articles and news stories have been published around the world. Follow the links below to see where we've been recently and what we've had to share with readers worldwide.
Chipworks Corner: A regular series of device-level process analyses, written for MICRO by Chipworks' senior technology advisor Dick James. According to Tom Cheyney (editor Chipshots Blog) For insider info, I turn to my friend and colleague Dick James, reverse-engineering/process-analysis maven at Chipworks.
Texas Instruments Pushes MEMS Envelope with Micromirror Based DLP
Fujifilm Maximizes Charge-Coupled Device's 0.35-um, Two-metal, Double-Poly Process
Infineon uses vertical structure to optimize on-resistance in power MOS devices
TSMC fabbed Matrix 3-D memory array with unique 0.15-um seven metal process
"Chip Forensics" a regular feature in Solid State Technology written Chipworks' senior technology advisor Dick James.
Freescale's process and fab strategy puts a new spin on MRAM
Chipworks' articles appear in EETimes (CMP publication) around the world, in print and online. Here are just some recent examples.
EETimes Korea, December 12, 2006
TI, 65nm UMC로 아웃소싱할 수도
EE Times Europe , December 08, 2006
Chipworks Inc., an engineering services company that specializes in deconstructing integrated circuits, has found possible indications that Texas Instruments Inc. has been outsourcing the manufacture of a 65-nanometer baseband chip for the Nokia 2610 GSM handset to foundry company UMC.
Chipworks ponders TI outsourcing 65-nm to UMC
EE Times , September 25, 2006
We'll take a look at the charge-coupled device sensor from a Fujifilm Finepix E550 6.3-Mpixel camera. For a point-and-shoot camera, the Finepix E550 delivers impressive resolution as well as ISO 800 sensitivity and 1/2,000-second shutter speed. To achieve those performance goals, Fujifilm fabricated the sensor using its proprietary Super CCD design. Super CCD sharpens camera's image
EE Times , July 24, 2006
Patent holders have always had the ability to assert their patents and go after companies that infringe them. But now comes a new breed of company that buys up patents and uses them as a means of collecting license fees. In many cases, these "patent trolls" are holding companies that don't do any product development; they merely amass patents they think can be used to make claims against various vendors. Patent trolls a costly thorn in industry's side
EE Times , July 21, 2006
The prospect that patent holders are becoming technology gatekeepers is emerging as a serious issue for the electronics industry. Concerns grow over 'patent trolls'
EE Times , January 26, 2006
The Presler and Yonah processors, built by Intel Corp. using 65-nanometer process technology, make use of copper pillar bumping (CPB) as an alternative to lead-tin solder balls, according to Chipworks Inc., an engineering consultancy that analyses semiconductor chips and systems. Pillars replace balls in Intel processor packaging.
(EETimes Taiwan
November 11, 2006
從事半導體晶片及微電子系統反向還原工程及分析的Chipworks近日宣佈，已針對Xilinx採用65奈米製程的XC5VLX50Virtex-5FPGA兩個元件樣本進行分析。其中一款元件由日本東芝(Toshiba)製造；而另一款元件則由台灣的聯電(UMC)製造，也是Xilinx過去10多年來的主要晶圓代工夥伴。Chipworks披露Xilinx 65奈米FPGA元件內部結構
(Electronic Design China)
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2006年11月27日
如何在管道式ADC设计中应用1.5位级技术
在高速管道化ADC中，1.5位级已成为高性能和高性价比的电路模块。利用基本1.5位级可实现高性能、低成本的高速管道式ADC。
2006年11月10日
Chipworks公司率先披露Xilinx 65纳米Virtex-5 FPGA元件的内部结构
致力于半导体晶片及微电子系统反向还原工程及分析的Chipworks公司近日宣布，已分析Xilinx公司采用65纳米制程的XC5VLX50Virtex-5 FPGA两个元件样本。
2006年08月07日
反向工程：监控专利的正当手段
反向工程是一种高效的方法，可以让公司保护他们的专利，?确保竞争对手没有非法使用这些专利，同时公司也可保护他们自己不会侵犯到竞争对手的专利。
2006年07月12日
为什么别人都在对付我？??如何应对专利屠夫与专利钓饵公司
现今充满了专利以及有关的诉讼，假如对专利许可还没有充分的认识，公司很可能为此付出极大的代价。为专利体系建立保护策略，同时了解专利领域内的不同玩家，可以有效防御专利陷阱或威胁。
2006年07月03日
提高NAND闪存密度将使外围电路更复杂
多级单元NAND闪存的容量提升以外围电路更为复杂为代价。
2006年04月04日
反向还原工程详尽解构三星的铜制CMOS影像感测器
反向还原工程厂商Chipworks公司近日宣布，分析了三星电子最新的S5K3BAF 2 Mp CMOS影像感测器(CIS)模组。这是Chipworks首次发现运用了130纳米铜制程的CIS技术。图像阵列的'De-Metallized Zone' (DMZ)结构消除了反射耐蚀层，促进了光学效率。
Don't get caught your patents down - by Terry Ludlow, Chipworks CEO
With ever more patent disputes going to court, it has never been more important for companies to build up strong evidence to back up their patent claims. Reverse engineering of competitor products has always played a large and important role in any successful assertive patent licensing program. Read the article.
Tighten your assets - by Steven Adam, vice president, Patent Intelligence
When executives, engineers and scientists look proudly at their patent display walls they see achievement, but they could also be looking at gold.
For many companies, their patents are a potential source of significant revenues that has remained untapped simply because the patents have not been evaluated, tested, revised before being issued by the patent office. Read the article.
Creating Profit from Reverse Engineering - by Dick James, senior technology advisor
Most North Americans are car buffs. And, when one bothers to think about it, it would be a reasonable supposition that when one of the big three US auto manufacturers launches a new model, the other two will buy some, take them back to the plant, and rip them apart to see what new features and technology are inside them. And then, if the new ideas are sales-worthy, they introduce similar innovations in their own models. Read the article.
Key Design Aspects of CMOS Image Sensors Revealed - by John Parangalan, design analysis engineer
What’s going on inside the latest cameras has a lot to say about the state of the art in digital imagers. This report offers tear-down analyses of CMOS image sensors (CISs) in mobile phones and professional digital single lens reflex cameras manufactured by Canon, Micron, Omnivision, Sony, and Toshiba. Read the article
1.5-Bit Stages In Pipeline ADCs - by Dave Treleaven, senior technical analyst
High-speed pipelined ADCs can take advantage of basic 1.5-bit stages to enhance performance and suppress cost. Use of pipeline analog-to-digital converters (ADCs) continues to expand, both as standalone parts and as embedded functional blocks in system-on-a-chip (SoC) ICs. They boast acceptable resolution at high-speed operation and can be integrated onto relatively small die area. Driven by IC chip cost factors, many commodity CMOS-technology SoCs now include embedded pipeline ADCs. Read the article