Structural Analysis

Structural Analysis Report (SAR): Outside-in.

Chipworks' Structural Analysis Reports provide comprehensive analyses of the process technology and design rules used to fabricate a device. Our reports come complete with evidence-based images and data to reinforce our findings. Advanced node reports also include, layout and topology analysis to help further your understanding of the die architecture.

Report Contents:

• Packaging overview including a package x-ray.
• Annotated die photograph identifying the location of memory blocks, significant components and sites where the various analyses were performed. If necessary, a photograph of a partially delayered die to reveal the die floor plan may also be included.
• Optional package overview section - if the packaging is of sufficient interest. This analysis typically includes cross-sectional images of the PWB, die, solder bumps and solder balls. SEM-based material analysis of the metallization may also be included.
• Top-down layer-by-layer analysis of the back-end processing, presented with SEM and TEM images to support each area of discussion. The overall structure is shown with details of the bond pads, dielectrics, metallization, vias and contacts. Material identification for these layers includes TEM-EDS of the metals and dielectrics, and/or SIMS of the dielectric stack.
• Analysis of the front-end processing including SEM and TEM images of the poly, transistors, isolation and substrate doping. SCM imaging and SRP analysis is used to profile the N and P type regions within the substrate.
• Memory cell analysis - if the device is a memory device or has a substantial amount of embedded memory. This includes a schematic of the unit cell, plan view SEM images of the cell delayered to the metal through substrate levels and cross-section images parallel to the bit line and word line.
• Layout - detailed SEM and optical plan-view images, at low and high magnification as required for making device-relevant conclusions. Shows,layout under bond pads, dummy metal patterns standard logic gate count estimate, and more.

The front end of our Structural Analysis Reports consists of an introduction, a device summary and a review of the major findings. From there, results are organized in an "outside-in" manner, beginning with a review of the parent product.

Resources and Related Information

Process Analysis

Structural Analysis Report Overview